* Reliability simulation and risk assessment of optical sensor packages with focus on thermal and (thermo-)mechanical design
* Process modelling of critical packaging assembly steps
* Calibration and validation of simulation by experiment
* Technical lead of package simulation project tasks
* Development/improvement of simulation and back-end material characterization techniques
* Coordination of characterization of new materials and implementation of results in database
* Interface with package design, materials development, quality, and project teams
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