Your future responsibilities
Join Silicon Austria Labs and drive innovation in Photonic Integrated Circuit (PIC-) technology on the pilot lines within the framework of the European Chips Act!
SAL is seeking two experienced Senior Research Engineers leading process development for PICs and ensuring stable, repeatable fabrication processes. One position will primarily focus on Aluminum Nitride (AlN) PIC fabrication, and the other on Thin-Film Lithium Niobate (TFLN) PIC fabrication
Key Responsibilities
PIC Fabrication & Development:Designing, fabricating, and testing PICs.
Platform Specialization: Focusing primarily on process development for either Aluminum Nitride (AlN) or Thin-Film Lithium Niobate (TFLN) Platform.
Technology ownership: Owning a platform flow (AlN or TFLN) and acting as a go-to person for fabrication topics, including coordination with cleanroom/process engineering and alignment with design/test needs. This includes mentoring and knowledge transfer, proactive risk/bottleneck identification and mitigation, and contributing to roadmap/benchmarking and experimental strategy.
DOE- Driven process development:
Developing and integrating process modules for stable, repeatable fabrication, increasing Technology Readiness Level (TRL) and pilot-line readiness.
Planning and executing Design of Experiments (DOE) to optimize processes.
Driving process integration, stability, and performance improvements for scalable fabrication.
Defining Process windows
Performing data-driven root-cause analysis
Fabrication: Hands-on work with key fabrication processes including lithography, deposition (PVD/ALD/PECVD), dry etch (ICP-RIE), metrology/SPC, and documentation/change control.
Collaboration & Teamwork:
Working closely with SAL’s process engineering team.
Collaborating to ensure high fabrication fidelity.<