We connect the real with the digital world
Besi is a leader in the research and development and production of high-end chip placement machines, with R&D, production, and sales offices around the world. We support the semiconductor industry with know-how and equipment to advance 5G broadband technologies, autonomous driving, artificial intelligence (AI), high-performance computing, and more.
Besi Austria was founded in 1986 and has been part of the Dutch Besi Group since 2005. Our company, one of Besi's R&D facilities, is located in Radfeld, Tyrol, where we have employees from over 25 nations.
Your areas of impact
1. Technology development from concept to qualification for Die Bonding products
2. Collaborate with cross-functional teams (design, image processing, electronics, control engineering, prototyping, mechatronics, purchasing, process development)
3. Develop and drive model-based design
4. Coordinate with product marketing, project management, and participate in supplier selection decisions
Your capacity for excellence
1. Completed higher education or relevant technical work experience, preferably in the field of engineering & technology
2. Experience in developing mechatronic systems, or a strong foundation in a related field
3. Familiarity with business decision-making processes
4. Good English language skills (written and oral)
5. Strong communication, teamwork, and problem-solving skills
Our commitment to nurturing your talents
We offer attractive and challenging work in a dynamic, team-oriented, and highly innovative company. You will be working in a highly qualified team with an individually adjustable flexitime model, social benefits, and numerous opportunities for professional and personal development.
Your salary will be based on your qualifications and experience and will be discussed with you personally. The minimum salary is based on the collective agreement for employees in the metal industry.
#J-18808-Ljbffr