Are you passionate about new technologies and future-oriented projects in semiconductor design? Photeon is the place for you!
As a market leader in turnkey solutions, Photeon offers the opportunity to work on a diverse range of products across Automotive, Compute, Industrial, Medical, and other markets. We are seeking a dynamic Senior Packaging Design Engineer to join our team and drive our projects to success. We provide an energetic, exciting, and friendly environment with numerous opportunities for your professional growth in the direction that suits you best.
We welcome you to become a key contributor to our success, fostering collaboration and teamwork every step of the way.
Your Role: As a Semiconductor Packaging Design Engineer, you’ll be the mastermind behind next-gen chiplet architectures, 3D packaging, and SiP (System-in-Package) technologies. You’ll collaborate across cross-functional teams and OSAT partners to deliver highly reliable, thermally optimized, and structurally sound package solutions.
* Develop and optimize packaging architectures for advanced semiconductor devices
* Perform thermal simulations and structural analyses to validate design integrity
* Integrate chiplet and 3D packaging concepts into manufacturable solutions
* Collaborate with OSATs on package design, testing, and quality validation
* Lead failure analysis investigations and propose design improvements
* Ensure design meets performance, reliability, and manufacturability targets
* Communicate technical insights across engineering, product, and operations teams
* Drive innovation and continuous improvement in packaging design methods
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