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Senior scientist - advanced wafer level packaging (all genders) / job-id: 239-1

Wernberg
Silicon Austria Labs
€ 60.000 - € 80.000 pro Jahr
Inserat online seit: 1 Jänner
Beschreibung

Our Future Responsibilities
To strengthen our interdisciplinary research team we are seeking a highly motivated researcher / engineer in the field of heterogeneous integration and advanced. In this role you will work on cutting‑edge technologies at the intersection of microelectronics, photonics, and RF systems, contributing to innovative developments from concept definition through fabrication and characterization. You will take an active role in challenging research and development projects and collaborate closely with industrial and academic partners.

Conduct research and development in the field of heterogeneous integration technologies

Design, fabricate and evaluate advanced packaging solutions such as RF/Si/photonic interposers and co‑packaged optics

Develop technology concepts, plan Design of Experiments (DOE) and perform process and device characterization

Carry out micro‑fabrication and backend processing in a cleanroom environment

Contribute backend and packaging solutions to a variety of industrial and collaborative projects

Perform data analysis and interpretation of experimental results

Prepare technical reports, internal documentation and support scientific publications and presentations

Take responsibility for project management, including coordination of tasks, timelines and technical deliverables

Profile
Ph.D. in Physics, photonics, microsystems fabrication, or electronics engineering (or relevant industrial experience). Minimum 5 years of experience in a relevant field.

In‑depth knowledge and hands‑on experience with advanced packaging processes such as interposers, photonic packaging, chiplets, FOWLP

Experience with wafer bonding and chip interposers

Good understanding of signal and power integrity in interposers

Familiarity with BGA, WLCSP, SiP, MCM, AiP, AoP, SoC design rules

Project management experience and research funding proposals

Fluent oral and written communication skills in English; knowledge of German is a plus

Benefits

Diverse research activities with many technical challenges

State‑of‑the‑art laboratory facilities and equipment

Location in the heart of Europe in Austria

Relocation support for non‑European nationalities

Internal and external training opportunities for career development

Family‑friendly environment actively shaping the compatibility of family and career

Health and wellness programmes including mental health support, physical activities, healthy snacks, and accident insurance

Meal allowance in restaurants or supermarkets, public transport initiative subsidy

Start as soon as possible

This position is subject to the Collective Agreement for employees in non‑university research (Research CA) starting in occupational group F (F1 salary EUR 4.757, paid 14 times a year based on 385 hours per week). For this position we offer competitive salaries and additional benefits based on your experience and qualifications, starting with a minimum gross salary of EUR 70,000 (annual based on an All‑in contract and bonus).

About Us
Silicon Austria Labs (SAL) is a top research centre for Electronics and Software‑Based Systems. At three locations (Graz, Villach, Linz), SAL conducts research along the entire value chain in sensor systems, power electronics, intelligent wireless systems, microsystems, and embedded systems to develop future‑oriented solutions for industrial production, health, energy, mobility, safety, and more.

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Home > Stellenangebote > Senior Scientist - Advanced wafer level packaging (all genders) / Job-ID: 239-1

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